KEY ELEMENTS IN SUCCESSFUL INTEGRATION OF FLEXIBLE CIRCUITS AND SURFACE MOUNT TECHNOLOGY
Author: Joseph Fjelstad Company: Tessera Date Published: 4/28/1997
Surface Mount International
Abstract: Flexible circuits have rightfully gained the reputation as a reliable and cost effective electronics packaging technique over the past two decades. However, the advantages off flex circuits can be synergistically enhanced by integrating them with surface mount technology. This paper discusses elements important to achieving success in combining the advantages of these two important interconnection technologies, providing examples of how others have accomplished the task.