SMTA International Conference Proceedings


METHODS USED IN THE DETECTION OF COUNTERFEIT ELECTRONIC COMPONENTS

Author: Harold “Woody” Hewett
Company: Electro-Comp Services, Inc.
Date Published: 10/24/2010   Conference: SMTA International


Abstract: In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the “red flags” that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-sam, full function testing and limited function testing.

Key words: counterfeit, integrated circuits, XRF, AS5553



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