SMTA International Conference Proceedings


Authors: Carsten Salewski and Jesper Lykke
Company: Viscom, Inc.
Date Published: 10/24/2010   Conference: SMTA International

Abstract: By using AOI and AXI in the PCB assembly process there is a great advantage in combining results for better defect detection and avoiding false alarms with most effective use of each technology. Viscom implemented a test strategy that allows to use AOI results for the most effective use of AXI.

Most assembly lines that utilize AOI for (optical) inspection of visible defects and AXI for concealed solder joints face the problem that they either retest components in the AXI test gate that passed the optical test or they don't use AXI on visually inspected components that might have hidden defects. Viscom's combined AOI/AXI inspection strategy proposes an efficient solution to the "dilemma". The paper/presentation covers: - typical inspection of BGA, QFP, QFN - test coverage of chip components with AOI -test coverage of BGA and QFN (void detection) with AXI - how AOI results that are close to the classification threshold are re-tested on AXI and classified as a combination of both - how AOI and AXI Combo is an effective solution (best utilization) - show a number for the saving (time and money) if not 100% retested - the option to use separate AOI (Viscom or other vendor) results for dynamically retest with AXI

Key words: AOI, AXI, X-ray, inspection.

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