COMPARISON OF VARIOUS METROLOGIES TO MEASURE VOIDS IN X-RAY IMAGES OF HIGH DENSITY BGA PACKAGE SOLDER BALLSAuthors: Ife Hsu and Raiyo Aspandiar, Ph.D.
Company: Intel Corporation
Date Published: 10/24/2010 Conference: SMTA International
The JEDEC 14-1 Committee therefore commissioned a Solder voids Task Group to investigate various metrology tools for matching when measuring voids in BGA balls that are attached to the package substrate, priori to soldering the component to the board. This paper will present the results from a couple of round robin studies conducted using 8 different metrology tools, both manual and automated, for measuring the void area within the in X-ray images of high density FCBGA component balls, obtained with a 2D Transmission X-ray tool. These results will also be compared with the void areas measured using a 3D Computer Tomography X-ray tool. This 3D tool is the designated `golden` metrology in this investigation since it is capable of clearly capturing and accurately measuring even small voids in the BGA balls.
The pros and cons of the presently used X-ray metrologies, such as 2D Transmission X-ray, X-ray Laminography, and cross-sectioning, and will be also be described.
Key words: Voids, 2D X-ray, Flip-Chip Ball Grid Array .
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