LAMINATE BASED FAN-OUT EMBEDDED DIE TECHNOLOGIES: THE OTHER OPTIONAuthors: Theodore (Ted) G. Tessier, Mark Dhaenens, David Clark, Tanja Karila, Tuomas Waris
Company: FlipChip International, LLC and Imbera Electronics Inc.
Date Published: 10/11/2010 Conference: IWLPC (Wafer-Level Packaging)
This paper provides an objective comparison of wafer level and laminate based embedded die fan-out technologies. Key 2D and 3D differentiators of laminate based approaches are presented. Technical and logistical considerations that enable these embedded die packages are discussed. Examples of recent embedded die semiconductor packages are described.
Keywords: Embeddable Die CustomizationTM, EDCTM, Redistribution, Laminate Embedded Die Fan-Out Packaging, iBGA®, iQFN®, iSiP®
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