ELECTRICAL, THERMAL AND MECHANICAL CHARACTERIZATION OF eWLB (EMBEDDED WAFER LEVEL BGA)Authors: Seung Wook Yoon, Meenakshi Prashant, Gaurav Sharma, Roger Emigh, Kai Liu, Sin Jae Lee, Ray Coronado, Yeong J. Lee, and Rajendra Pendse
Company: STATS ChipPAC
Date Published: 10/11/2010 Conference: IWLPC (Wafer-Level Packaging)
This paper will highlight some of the recent characterization works of electrical, thermal and mechanical performance of eWLB packaging. The performance compared with other packaging format, ie. FI-WLP (Fan In-WLP) and fcBGA (flipchip Ball Grid Array) packages is discussed. Thermal resistance, ?ja of eWLB packaging is studied and it is found comparable with those of FI-WLP and fcBGA. Thermal characterization activity is carried out to investigate the effect on eWLB configuration with power loading. Thin film based integrated passives on the fan-out area (mold material) of the eWLB is also analyzed during RF performance characterization. Due to the low-loss property of the mold material, plated Cu inductors showed high quality-factor (Q) performance. The mold material in fan-out area is not only used as a supporting substrate, but also serves as the package substrate, which allows the high-Q inductors to be implemented with other RF chips in one single package. Parasitic electrical performance and characterization works will be presented in this paper. eWLB package warpage behavior with temperature profile observed with Thermo-Moire method result will be presented in this paper too.
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