EXPLORATION OF MIGRATION AND STRESS EFFECTS IN POPS CONSIDERING INHOMOGENEOUS TEMPERATURE DISTRIBUTIONAuthors: L. Meinshausen and K. Weide-Zaage
Company: Leibniz University Hannover
Date Published: 10/11/2010 Conference: IWLPC (Wafer-Level Packaging)
Electromigration or temperature cycle tests are performed in ovens with a constant ambient temperature. Previous simulations based on homogenous temperature fields. During this work thermal- electrical and thermal-mechanical simulations with inhomogeneous temperature fields, caused by the heat loss of the mounted ICs, were performed. Simulations with rising ambient temperatures were also performed. Based on the thermal-electrical results the electromigration induced mass fluxes and mass flux divergences were calculated with user routines. The simulations include a homogenous heat loss all over the ICs surfaces and a hot spot near to the bump chain.
Keywords: Bump, electromigration, void growth, reliability, heat sources
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