IWLPC (Wafer-Level Packaging) Conference Proceedings


WAFER LEVEL PACKAGING: A FOUNDRY PERSPECTIVE

Author: Michael Shillinger
Company: Innovative Micro Technology
Date Published: 10/11/2010   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Wafer-level packaging (WLP) and customized electrical I/O schemes have become mature technology platforms within the MEMS industry. The need for these technologies was dictated by the sensitive nature of MEMS devices in the ambient environment. This paper will discuss design, processes and testing considerations of both WLP and electrical I/Os.



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