IWLPC (Wafer-Level Packaging) Conference Proceedings


WAFER LEVEL PROCESSING AND INTEGRATION TECHNIQUES FOR CMOS IMAGE SENSOR MODULE MANUFACTURING

Authors: Bioh Kim, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, and Paul Lindner
Company: EV Group, Inc.
Date Published: 10/11/2010   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Image sensors have become ubiquitous, appearing in cellular phones, car sensors, notebook webcams, digital cameras, video camcorders, and security & surveillance systems. CMOS image sensors gave birth to the low-cost, high-volume camera phone market and are being adopted for various high-end applications. The backside illumination technique has significant advantages over the front-side illumination on account of separating the optical path from the high density metal interconnects. Wafer bonding plays a key role in manufacturing backside illuminated sensors. The cost-effective integration of miniaturized cameras in various handheld devices becomes a reality through the introduction of CMOS image sensor modules manufactured with waferlevel processing and integration techniques.

In order to realize cost-effective manufacturing of CMOS image sensor modules or camera modules, we developed various technologies enabling wafer-level processing and integration, such as (a) wafer-to-wafer permanent bonding with oxide or polymer layers for manufacturing backside illuminated sensor wafers, (b) wafer-level lens molding and stacking based on UV imprint lithography for making wafer-level optics, (c) conformal coating of various photoresists within high aspect ratio through-silicon vias, and (d) backside lithography for various metallization processes in wafer-level packaging. Those techniques improve the electrical and optical aspects of devices as well as the module manufacturability, and thus pave the way to the future growth of the digital imaging industry.

Key words: CMOS image sensor, wafer-level camera, wafer-level optics, wafer-level processing and integration



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