WAFER LEVEL PROCESSING AND INTEGRATION TECHNIQUES FOR CMOS IMAGE SENSOR MODULE MANUFACTURINGAuthors: Bioh Kim, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, and Paul Lindner
Company: EV Group, Inc.
Date Published: 10/11/2010 Conference: IWLPC (Wafer-Level Packaging)
In order to realize cost-effective manufacturing of CMOS image sensor modules or camera modules, we developed various technologies enabling wafer-level processing and integration, such as (a) wafer-to-wafer permanent bonding with oxide or polymer layers for manufacturing backside illuminated sensor wafers, (b) wafer-level lens molding and stacking based on UV imprint lithography for making wafer-level optics, (c) conformal coating of various photoresists within high aspect ratio through-silicon vias, and (d) backside lithography for various metallization processes in wafer-level packaging. Those techniques improve the electrical and optical aspects of devices as well as the module manufacturability, and thus pave the way to the future growth of the digital imaging industry.
Key words: CMOS image sensor, wafer-level camera, wafer-level optics, wafer-level processing and integration
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.