THE EFFECT OF SILVER CONTENT ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGEAuthors: Richard Coyle, Peter Read, Richard Popowich, Debra Fleming; Heather McCormick; John Osenbach; John Manock
Company: Alcatel-Lucent; Celestica, Inc.; LSI Corp.
Date Published: 10/24/2010 Conference: SMTA International
The test results show that the thermal fatigue performance improved substantially with a higher Ag content BGA alloy. Surprisingly, assembly with the higher Ag solder paste resulted in a measureable though small increase in thermal fatigue performance of both the SAC305 ands SAC105. The characteristic fatigue lifetime was inversely proportional to the test dwell time, which is consistent with previously published findings on this BGA package as well as SAC solders in general.
Key words: Pb-free solder, Ag content, thermal fatigue, accelerated temperature cycling, dwell time.
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