SMTA International Conference Proceedings


THE DEVELOPMENT OF AN IMPROVED TIN-ZINC SOLDER

Authors: Keith Sweatman, Takashi Nozu, Tetsuro Nishimura
Company: Nihon Superior Co., Ltd.
Date Published: 10/24/2010   Conference: SMTA International


Abstract: Although the tin-zinc system has a eutectic at 9% zinc that looks promising as the basis for a low melting point lead-free solder, so far only very limited success has been achieved in realising that potential in commercial mass production. The problems that have limited the success of alloys based on this eutectic include their chemical reactivity, which tends to make it unstable in solder paste formulations, and its susceptibility to corrosion in service. Options for enhancing the performance of alloys based around the tin-zinc eutectic include modification of the alloy with targeted dopants and formulating solder paste flux medium that do not react with the alloy until the point of reflow. In this paper the authors report work undertaken with a view to identifying an alloy based around the tin-zinc eutectic that could provide performance advantages in some situation

Key words: Lead-free, Tin-Zinc, Corrosion, CTE, Shrinkage Stress



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