Surface Mount International Conference Proceedings


Author: Satya Chillara
Company: Fujitsu Computer Packaging Tec
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: This paper describes how build-up (I-Al) laminate technology was utilized on a high pin count, 517 MCM BGA package. The 517 MCM BGA package has six laminate layers (4L + 2D). This translates to four laminate core layers and one build-up (thin film) layer on each side of the core. The package houses two high pin count devices that were wirebonded and transfer molded. Also, the paper covers the advantages of build-up technology with respect to the laminate technology, design details of the build-up, build-up fabrication methodology, wirebondability studies on the build-up substrate with comparisons to the traditional laminate BGA substrate technology. Finally, the reliability data on the build-up-technology will be discussed.

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