LOW-SILVER BGA ASSEMBLY PHASE II – RELIABILITY ASSESSMENT SIXTH REPORT: THERMAL CYCLING RESULTS FOR UNMIXED JOINTSAuthors: Gregory Henshall, Michael Fehrenbach; Chrys Shea; Quyen Chu,Girish Wable; Ranjit Pandher; Ken Hubbard, Gnyaneshwar Ramakrishna; Ahmer Syed
Company: Hewlett-Packard Co.; Shea Engineering Services; Jabil Circuit; Cookson Electronics; Cisco Systems; Amkor Technology
Date Published: 10/24/2010 Conference: SMTA International
The current study has been undertaken to characterize the influence of alloy type and reflow parameters on low-silver SAC spheres assembled with backward and forward compatible pastes and reflow profiles. This study combines low-silver sphere materials with tin-lead and lead-free SAC305 solder pastes under varied reflow conditions. Solder joint formation and reliability are assessed to provide a basis for developing practical reflow processing guidelines and to assist in solder joint reliability assessments.
This is the sixth report in a series being published as results become available, and presents results of the thermal cycling portion of the test program. Thermal cycling conditions include both 0 to 100oC and -40 to 125oC, with 10 minute dwell times.
The accelerated thermal fatigue reliability of Pb-free solder joints with varying Ag and “micro alloying” element concentrations is compared with that of 100% Sn-Pb joints for four different package types. Further, the impact of thermal cycle conditions on the rank order of the reliability for the different solder joint compositions is presented. The implications of the data regarding the efficacy of using BGAs balled with low Ag alloys, and areas for future work are discussed.
Key words: low-silver alloys, therm
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.