SOLDER JOINT RELIABILITY OF Pb-FREE TIN-SILVER-COPPER CERAMIC BALL GRID ARRAY (CBGA) PACKAGES AS A FUNCTION OF COOLING RATE AND SILVER CONTENTAuthors: Richard Coyle, Peter Read, Debra Fleming, Richard Popowich, Iulia Muntele; Robert Kinyanjui, Jonathon Shirey, Mulugeta Abtew, John Manock
Company: Alcatel-Lucent; Sanmina-SCI Corp.
Date Published: 10/24/2010 Conference: SMTA International
The ATC test data and failure analysis results are discussed in terms of the relationship to the evolving microstructure and the resultant mechanical behavior from temperature cycling. The results show the influence of the assembly cooling rate and Ag content on the characteristic thermal fatigue lifetime. However, the magnitude of those effects was reduced significantly when the ATC testing is performed using longer dwell test times. Additionally, the results show that the reliability of SnPb eutectic solder likewise is sensitive to cooling rate and cycling dwell time but the dependencies are different than those for SAC solders.
Key words: CBGA, Pb-free solder, accelerated temperature cycling, cooling rate
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