HIGH COMPLEXITY LEAD-FREE WAVE AND REWORK: THE EFFECTS OF MATERIAL, PROCESS AND BOARD DESIGN ON BARREL FILLAuthors: Craig Hamilton, John McMahon, Jose Traya, Wang Yong Kang, Khoo Kok Wei; Matthew Kelly, Marie Cole
Company: Celestica Inc.; IBM Corporation
Date Published: 10/24/2010 Conference: SMTA International
This paper focuses on the outcome of a development program which was designed to address the ability to maximize pin-through-hole solder joint quality and reliability performance for use in high complexity server/storage class hardware assemblies. Factors including alloy type, flux selection, surface finishes, atmosphere and wave nozzle configurations are studied. This program utilized both an internally designed test vehicle (TV), in addition to a product vehicle (PV). Actual product design points and connector technologies were integrated into the test vehicle design, in order to represent real-life design features throughout the experiment. In addition, various design features such as, pin-to-hole ratio, ground layer connections and thermal relief designs were incorporated into the test vehicle design, to understand the impact of board design on final barrel fill results and provide a data set to support any design for manufacturing (DFM) change recommendations.
Key words: High Complexity, Wave Solder, Rework, Lead Free, Barrel Fill, Design for Manufacturing
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