Surface Mount International Conference Proceedings


CHALLENGES WITH THE BGA PROCESS: THE THICK AND THE THIN

Author: Mike Buseman
Company: Manufacturers’ Services
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: As the popularity of ball-grid array (BGA) devices continues to grow, designers are broadening the applications of the technology. Most information available today focuses on single-sided 0.062” (1.5 mm) thick assemblies and falls far short of providing tools for assembling BGAs in non-standard designs. From the beginning, BGA’s allure has been it’s ability to “drop in” to the current assembly process, but migrating BGA onto these more complex design platforms requires further evaluation of proven, established manufacturing processes. In short, the current explosion in BGA popularity is driving many new design applications of the technology but there is a noticeable lack of quantitative data available. This paper will outline the methodology utilized to qualify the BGA assembly process in an Electronics Manufacturing Services (EMS) environment and will then highlight the BGA assembly process for two different design extremes. After fist establishing statistical documentation that the existing assembly process was robust enough to consistently build highly reliable BGA assemblies, a team of engineers at Manufacturers’ Services Central U.S. Operations developed and implemented, manufacturing processes for both the ‘thick’ and the ‘thin’ extremes of BGA assembly. A 0.130 (3.25 mm) thick, large format board with multiple ceramic column grid arrays provided the ‘thick’ application, and a 0.01S” (0.5 mm) thick PCMCIA board. provided the ‘thin’ application. This paper will document the methodology involved with the qualification process, along with lessons learned along the way. It will detail the following major steps: . BGA Qualification Process Overview l The “Thin”- Process Characterization of 0.018” PCMCIA Assembly with Plastic Ball Grid Array (PBGA)  Thermal management issues  Equipment and tooling issues  Repair issues  The “Thick”- Process Characterization of 0.130” Laminate with Ceramic Column Grid Array (CCGA)  Thermal management issues  Equipment and tooling issues  Repair issues  . Future Plans  Execution of the plan  Summary of qualification



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