NASA DoD -55°C TO +125°C THERMAL CYCLE TEST RESULTS
Authors: Dave Hillman, Tim Pearson, Ross Wilcoxon Company: Rockwell Collins Date Published: 10/24/2010
Abstract: The implementation of lead-free soldering processes and materials in the commercial electronics sector has been completed due to the European Union Waste Electrical and Electronic Equipment (WEEE) and Reduction of Hazardous Waste (RoHS) Directives. These environmental legislative directives were targeted at industrial and commercial electronic products but had an unintended impact on aerospace/defense products due to global supply chain transition actions. A group of industry, academia, and government agencies initiated a lead-free solder alloy reliability investigation, building on an previous successfully completed activity, to characterize and understand various aspects of lead-free solder joint integrity under -55°C to +125°C thermal cycle conditions. The goal of the testing was to generate reliability data for test vehicles that were representative of IPC Class III High Performance Electronic products.