HIGH RELIABILITY BOND PADSAuthors: Terence Collier, Bal Benavidez, Indira Gubeljic
Date Published: 10/24/2010 Conference: SMTA International
The most common method of connectivity between the known good die and other circuitry is with a gold wire. Other techniques such as pad redistribution (RDL) can be accomplished that help facilitate the use of smaller pads in the order of 8-10um but the typical size range of bondpads are in the 50-90um range depending on the technology. Gold wires attach to the bondpad of the known good die and can attach to other die, printed circuit boards, substrates, etc.
Key words bondpads, corrosion, ENIG, reliability
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