SMTA International Conference Proceedings


HIGH RELIABILITY BOND PADS

Authors: Terence Collier, Bal Benavidez, Indira Gubeljic
Company: CVInc
Date Published: 10/24/2010   Conference: SMTA International


Abstract: The greatest system ever made is only as great as the weakest link in the system. Even a Cadillac will produce a bumpy ride with a flat tire. For a semiconductor with a known good die (KGD) the link to the outside world can be the most challenging aspect. This connectivity between the die and remainder of the circuit is the most vital link in the system. While a majority of the features on the chip can be fabricated in the submicron realm the contact to the outside world still ranges in geometry in the tens of microns.

The most common method of connectivity between the known good die and other circuitry is with a gold wire. Other techniques such as pad redistribution (RDL) can be accomplished that help facilitate the use of smaller pads in the order of 8-10um but the typical size range of bondpads are in the 50-90um range depending on the technology. Gold wires attach to the bondpad of the known good die and can attach to other die, printed circuit boards, substrates, etc.

Key words bondpads, corrosion, ENIG, reliability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819