Surface Mount International Conference Proceedings


Author: Larry W. Burgess
Company: MicroPak Laboratories
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: Electronic manufacturers continue to design increased product functionality and performance. Pressures to reduce the size of a product, drive product costs down and shorten product development cycles continue to increase component interconnect densities at the circuit board level. The options are: increase the number of layers for routing traces, reduce space and trace widths, reduce via and pad sizes, or use blind vias within surface mount pads. Realistically, all the above options should be considered. The primary bottleneck is the via pad on the circuit board design blocking routing channels. This paper will discuss the options and show the most effective consideration is the via-in-pad interconnection. Key words: Laser-drilled, Via-in-Pad, Blind Via.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819