Surface Mount International Conference Proceedings


PUTTING BLIND VIAS IN SMD PADS: “WHERE THEY BELONG”

Author: Larry W. Burgess
Company: MicroPak Laboratories
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Electronic manufacturers continue to design increased product functionality and performance. Pressures to reduce the size of a product, drive product costs down and shorten product development cycles continue to increase component interconnect densities at the circuit board level. The options are: increase the number of layers for routing traces, reduce space and trace widths, reduce via and pad sizes, or use blind vias within surface mount pads. Realistically, all the above options should be considered. The primary bottleneck is the via pad on the circuit board design blocking routing channels. This paper will discuss the options and show the most effective consideration is the via-in-pad interconnection. Key words: Laser-drilled, Via-in-Pad, Blind Via.



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