MEASUREMENT AND ANALYSIS OF BGA DEFECTS WITH ADVANCED X-RAY INSPECTION SYSTEMS
Author: Richard Amtower Company: CR Technology Date Published: 9/12/1999
Abstract: Real-time x-ray inspection is an essential tool for process and quality control of the assembly of BGA devices on printed circuit boards. The key factors in selecting an x-ray system are resolution, magnification and image quality, integrated with image processing and analytical tools. As BGA device technology has evolved, the requirements for x-ray inspection systems have increased significantly. This article describes x-ray system performance features and the requirements for inspection capability, emphasizing process-critical measurements such as voiding. The advantages of geometric magnification, rotation for angled viewing, and high resolution are essential as solder bump sizes shrink and bump density increases. Accurate and repeatable tools for measuring and recording BGA defect data are critical to understanding and controlling process parameters. Key words: X-Ray, BGA, voiding, solder joints quality checking.