Surface Mount International Conference Proceedings


Author: Nicholas Brathwaite
Company: Flextronics International
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: With the semiconductor industry leading the rapid expansion of the electronic industry, development of electronic manufacturing technology is also on a parallel pace. Functionality, performance, and 1/0 counts continue to increase significantly for semiconductor devices. Most dramatically, the total package 1/0 count increase has forced an increase in package sizes, instead of decrease, without any corresponding gains in silicon density by the reduction in chip sizes. Assisted by advancements on miniaturized and high-density SMT component packaging developments and advanced assembly process technologies, SMT technology has constantly rejuvenated itself to meet challenging demands, and probably will remain the dominant electronic manufacturing processes for coming years. Advanced assembly technologies are being developed as complements to traditional SMT technology. However, few of these technologies have arrived on the production line. In light of the rapid changes in electronic components, products and market demand, it is important that the most promising of these arrive soon in order to help OEM partners compete with miniaturized products produced at lower cost in a world of time-based competitiveness. Ball Grid Array (BGA) and its sister technology, pBGA, are going mainstream. . . For the most part, BGAs have won the debate over what succeeds conventional SMT.’ This paper describes Flextronics’ BGA assembly process qualification and transfer to production as a powerfull tool to help customers compete using ever-smaller products, produced rapidly at lower cost.2 Current technology development must have a specific focus on system miniaturization involving the evaluation of key advanced interconnect technologies in order to predict likely industry direction, customer needs, and the various tradeoffs between the implementation, cost and infrastructure of the technology. In order to continue to offer advanced manufacturing assembly services, an Electronic Manufacturing Services (EMS) supplier must:  Forecast current and near-term market demand  Forecast likely technologies under development  Invest for new miniaturization technology development  Enhance and diversi~ existing process technologies for  new applications  Introduce new technology and benefits to customers  Collaborate with customers on new product development  and old product renovation  Assist customers to gain market advantage by utilizing new and existing advanced manufacturing technologies.

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