SMTA International Conference Proceedings


CHALLENGES OF PACKAGING Cd-Zn-Te (CZT) DETECTORS

Authors: Charles G. Woychik, Ph.D., Brian D. Yanoff, Ph.D., James E. Simpson, Ph.D., Jay Cao, Ph.D., Ian M. Spinelli, Vincent S. Smetkowski, Ph.D.; James Adriance, Lawrence Harvilchuck, Brian Roggeman, George Westby
Company: GE Global Research; Universal Instruments Corporation
Date Published: 10/24/2010   Conference: SMTA International


Abstract: Cd-Zn-Te (CZT) is a compound semiconductor used for radiation detection, which directly converts X-ray or gamma ray photons into electrons. CZT is relatively brittle and prone to cracking under mechanical stress. Improvements are demonstrated to the ruggedness and reliability of CZT detector technology using advanced packaging and assembly technologies by controlling the stress in the CZT crystal adjacent to the interconnection that joins the crystal to the substrate. Finite element modeling (FEM) and experimental measurements have been conducted to quantify the amount of stress that a CZT crystal can withstand prior to cracking. From this work it was determined that the critical stress region to initiate cracking in CZT occurs in the range of 18-50 MPa. Two new interconnect configurations were evaluated: A polymer ball and tall epoxy interconnect both produced stresses well below this range when subjected to thermal cycling (80-22?C) and 1000g drop shock loads.

Key words: crystal, radiation detector, CZT, compound semiconductor, conductive epoxy, shock, thermal cycling



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819