RELIABILITY TESTING OF LINEAR IMAGE SENSOR DEVICES
Authors: Awni Qasaimeh, Mridula Gosavi, Frank Andros, Susan Lu, Bahgat Sammakia; Mike Joyner, Mike Sullivan, Jeff Zarnowski Company: Binghamton University; Panavision Imaging, LCC Date Published: 10/24/2010
Abstract: In this study the reliability of leadless chip carrier (LCC) linear image sensors (LIS) was investigated. Different devices were tested; ELIS 1024 thermally cured epoxy and LIS 1024 U-V cured epoxy components for different soldering alloys (eutectic Sn-Pb and Pb free). Accelerated reliability tests conducted in accordance with JEDEC standards, were high temperature operating life (HTOL), accelerated thermal cycling (ATC), and temperature- humidity- bias (T/H/B) life test. Calculated MTTF indicates that ELIS Sn-Pb components with thermally cured cover plate epoxy had the best reliability (~ 5 years) followed by the Pb free ELIS with thermally cured epoxy and LIS Pb free with UV cured epoxy (~ 3 years). Failure analysis was also conducted on the failed parts using different techniques such as visual inspection, X-ray, scanning acoustic microscopy (SAM), and cross-sectioning. Observations such as fogging of glass, damaged bond pads, chipped glass, glass misalignment, die damage, and epoxy patches under the glass were noted in the failed devices.