THE ENCAPSULATION OF MEMS/SENSORS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING TECHNOLOGYAuthors: Ton van Weelden and Lingen Wang
Company: Boschman Technologies B.V.
Date Published: 10/24/2010 Conference: SMTA International
Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adapted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window.
Key words: Film assisted technology, MEMS and Sensor encapsulation, wafer level molding, Thru-mold via
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.