SMTA International Conference Proceedings


THE ENCAPSULATION OF MEMS/SENSORS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING TECHNOLOGY

Authors: Ton van Weelden and Lingen Wang
Company: Boschman Technologies B.V.
Date Published: 10/24/2010   Conference: SMTA International


Abstract: To meet the needs of ambient intelligence and the miniaturization of electronics, a MEMS/sensor package with exposed windows needs access to the environment. This presents a challenge for MEMS or sensor packaging/encapsulation. The exposed die and MEMS/sensor are brittle and can not withstand large stresses. By clamping the film around the chip's functional area, the surface of the chip is protected by film and the MEMS/Sensors exposed window will be bleed and flash free. Relative to the clamping force on steel, the clamping force when using soft film is dramatically decreased. Film Assisted Molding (FAM) technology can meet the packaging demands of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS Microsystems with low cost and excellent performance.

Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adapted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window.

Key words: Film assisted technology, MEMS and Sensor encapsulation, wafer level molding, Thru-mold via



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