THERMAL WARPAGE OF FLIP-CHIP PLASTIC BALL GRID ARRAY COMPONENT: EXPERIMENT AND MODELING
Authors: A. Shirazi, H. Lu, and A. Varvani-Farahani Company: Ryerson University-Department of Mechanical Engineering Date Published: 10/24/2010
Abstract: This paper presents the methodology and application examples that use warpage measurement data to support the manufacturing focused effort for evaluating thermal behaviour of flip-chip plastic ball grid array (FC-PBGA) component. A Hybrid Experimental Analytical Inverse Method (HEAIM) is devised, assisted by a newly developed non-local two-dimensional warpage model, to identify effective parameters for the assessments of component performance in board level assembly process. Warpage and other thermo-mechanical characteristic parameters of up to six types of the packages varying slightly with design, constituent material or manufacturing home are evaluated and the values of them are used as performance indicators/criteria in the assessment of these packages. Due to the analytical nature of the model the output of the evaluations can be efficiently extrapolated and used in the prediction of similar class of components with different designs or assembled with different processing technologies.