MOISTURE AND CONTAMINATION CONSIDERATIONS FOR LONG TERM STORAGE OF END OF LIFE ELECTRONIC COMPONENTS
Author: Lee Melatti Company: Channel One International Date Published: 10/24/2010
Abstract: The applicable IPC/JEDEC standards addressing moisture sensitive devices are J-STD-020D.1 and J-STD-033B.1 and GEIA-STD-003. The standards deal primarily with moisture intrusion into device packages and the threat of destructive delamination during solder reflow. This failure mechanism has proven to be a significant concern and becomes more critical in the context of RoHS compliant products, long term storage and very fine geometry VLSI components. Many now believe the IPC/JEDEC standards are not stringent or comprehensive enough to account for the case where components are irreplaceable and where systems are mission critical. Of specific concern are the areas of long term reliability, corrosion, the effects of internal interface damage and contamination. These failure modes are not fully addressed in the current IPC/JEDEC standards. Component reliability concerns are especially relevant when dealing with mission critical systems.