ROOM TEMPERATURE LED AND D-PAK TYPE COMPONENT-ATTACH AND RELIABILITY TESTINGAuthors: T. Acchione and M. Scalzo
Company: Indium Corporation
Date Published: 10/4/2010 Conference: SMTA International
Technology developments have proven that it is possible to use a localized heat source to bond components at room temperature. This paper discusses the bonding of LED and D-pak components at room temperature. It also talks about the quality and long term reliability of the components. The presentation will demonstrate the component bonding process both manually and through the use of automation, and show attendees how to verify the performance of the components post bonding.
Key words: NanoFoil, NanoBond, LED, CTE mismatch, room temperature bonding.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.