SMTA International Conference Proceedings


Authors: T. Acchione and M. Scalzo
Company: Indium Corporation
Date Published: 10/4/2010   Conference: SMTA International

Abstract: Engineers working with LED and D-pak type component-attach are looking for improved assembly materials and process enhancements to increase throughput, reduce cost, and improve product efficiency and reliability. Many of these packages are susceptible to higher voiding on the ground plate-attach during reflow. A room temperature process would lower voiding, reduce the failure rate, and increase the lifetime of the component.

Technology developments have proven that it is possible to use a localized heat source to bond components at room temperature. This paper discusses the bonding of LED and D-pak components at room temperature. It also talks about the quality and long term reliability of the components. The presentation will demonstrate the component bonding process both manually and through the use of automation, and show attendees how to verify the performance of the components post bonding.

Key words: NanoFoil, NanoBond, LED, CTE mismatch, room temperature bonding.

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