SMTA International Conference Proceedings


HEAD-IN-PILLOW: ALARM STILL RINGING? A CONTINUATION STUDY ON KNOWN CHEMICAL AND MECHANICAL FACTORS IN BGA NON-WET

Authors: Masato Shimamura and Tomoko Nonaka; Tetsuya Okuno, Satoru Akita, and Derek Daily
Company: Senju Metal Industry Co, Ltd.; Senju Comtek Corporation
Date Published: 10/24/2010   Conference: SMTA International


Abstract: Intended as a continuation study to work presented at SMTAi 2009, this paper will further review findings related to the chemical and mechanical causes of BGA/CSP bump to SMT paste non-wet, known also as Head-In-Pillow (HIP), prevalent within the industry. The paper will explore ball attach chemistry variation, deflux processes and other factors affecting the issue as introduced in the previous work. Both no-clean and water-soluble processes will be reviewed.

Key words: Head-in-Pillow, BGA non-



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