SMTA International Conference Proceedings


Author: Dudi Amir
Company: Intel Corporation
Date Published: 10/24/2010   Conference: SMTA International

Abstract: In the last few years there has been a trend for notebook computers, cell phones and other handheld electronic devises to become thinner and thinner. In order to reduce the package height, there is an increase in the use of solder grid array (SGA) and land grid array (LGA) packages. This paper will examine these different packages and compare them to BGA. It will discuss the challenges during SMT and how to overcome them to have a successful assembly. The paper will also describe the common failures during SMT and give potential solutions to prevent defects and have a robust SMT assembly process.

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