SMTA International Conference Proceedings


LAND AND SOLDER GRID ARRAY SMT ASSEMBLY CHALLENGES

Author: Dudi Amir
Company: Intel Corporation
Date Published: 10/24/2010   Conference: SMTA International


Abstract: In the last few years there has been a trend for notebook computers, cell phones and other handheld electronic devises to become thinner and thinner. In order to reduce the package height, there is an increase in the use of solder grid array (SGA) and land grid array (LGA) packages. This paper will examine these different packages and compare them to BGA. It will discuss the challenges during SMT and how to overcome them to have a successful assembly. The paper will also describe the common failures during SMT and give potential solutions to prevent defects and have a robust SMT assembly process.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819