SMTA International Conference Proceedings


SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY

Authors: Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D.
Company: Indium Corporation
Date Published: 10/24/2010   Conference: SMTA International


Abstract: Consideration and selection of dip transfer fluxes and solder pastes for PoP assembly are described, based on process considerations. The crucial properties vital for successful dip transfer include homogeneity, open time on the flux/paste bed, volume and consistency of the dip transferred material, open time after the dip transfer before reflow, and solder joint formation. For each property, one or more practical, recommended test methods are described. Overall, this work should provide the assembly house with an easy way to select a flux or solder paste adequate for dip transfer of PoP assembly applications.

Key words: PoP, Package-on-Package, flux, solder paste, dip transfer, soldering, SMT



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