ICSR (Soldering and Reliability) Conference Proceedings


Weight Limits For Double Sided Reflow Of QFNs

Authors: Sasha Smith, David Connell and Bev Christian
Company: Research In Motion
Date Published: 5/17/2010   Conference: ICSR (Soldering and Reliability)


Abstract: QFNs of two different sizes with different weights attached to them were used to determine the maximum potential weight of a QFN that could be held on a printed circuit board by SAC305 solder surface tension alone when the board was upside down in a reflow oven. Different pad geometries were used and the effect of voiding was also taken into consideration.



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