ICSR (Soldering and Reliability) Conference Proceedings


Process Optimization To Prevent The Graping Effect

Authors: Ed Briggs and Ron Lasky
Company: Indium Corporation
Date Published: 5/17/2010   Conference: ICSR (Soldering and Reliability)


Abstract: The explosive growth of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive electrical components. Not too long ago, 0401 (40 x 10 mils) passives were seen as the ultimate in miniaturization, yet the introduction of 0201’s and most recently 01005 passives has occurred. For active components, area array packages with 0.4mm lead spacing have become virtually a requirement for enabling the many features in modern portable electronic devices, with 0.3mm packages already on the way.

This miniaturization trend, occurring at the same time as the conversion to RoHS compliant lead-free assembly, has put a considerable strain on the electronic assembly industry. This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon. Discussed are the effects of the solder paste material attributes, consistent stencil printing of the small solder paste deposits required, and minimizing oxidation of the small solder paste deposit during reflow. All of these steps are necessary to assure a good finished solder joint.



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