Process Optimization To Prevent The Graping EffectAuthors: Ed Briggs and Ron Lasky
Company: Indium Corporation
Date Published: 5/17/2010 Conference: ICSR (Soldering and Reliability)
This miniaturization trend, occurring at the same time as the conversion to RoHS compliant lead-free assembly, has put a considerable strain on the electronic assembly industry. This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon. Discussed are the effects of the solder paste material attributes, consistent stencil printing of the small solder paste deposits required, and minimizing oxidation of the small solder paste deposit during reflow. All of these steps are necessary to assure a good finished solder joint.
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