ICSR (Soldering and Reliability) Conference Proceedings


Experimental Mechanics Based Approaches To Package Reliability: Some Recent Applications

Authors: Hua Lu, Ming Zhou, Alireza Shirazi and Cuiru Sun
Company: Ryerson University
Date Published: 5/17/2010   Conference: ICSR (Soldering and Reliability)


Abstract: Optical and computer-vision based deformation measurement can play a role in prototyping and product based reliability evaluation by determining the critical failure conditions for real materials in real packages subject to real conditions. The experimental mechanics based approach applied to such evaluations avoids the dilemma caused by uncertain material behavior in failure physics based analysis. Recent case studies presented here illustrate the test approach, data analysis and failure correlation. The applications show that such assessments facilitate the prototype testing, design selection, concept validation and failure diagnosis with less concern about the uncertainties related to material and structure complexities. Furthermore, the in-situ deformation measurement contributes to understanding fundamental topics of interest in packaging reliability. Noting that the validity of the investigations has much to do with the quality of the measurements, proper choice of techniques, design of experiment and experimental craftsmanship are addressed.

Key words: experimental mechanics, reliability, in-situ measurement



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