A Geometry And Size Independent Failure Criterion For Fracture Prediction In Lead-Free Solder JointsAuthors: Siva P. V. Nadimpalli and Jan K. Spelt
Company: Department of Mechanical and Industrial Engineering, University of Toronto
Date Published: 5/17/2010 Conference: ICSR (Soldering and Reliability)
This serves as a strength property for the solder-substrate system. In the second part of the investigation, fracture of discrete solder joints was simulated using elastic and elasticplastic finite element methods, and crack initiation was predicted using the measured Gci and Jci values for this solder system. The predictions matched reasonably well with the measured values. An interesting observation was that the failure of joints less than 2 mm in length can be predicted using the fracture parameters at initiation from continuous joints. This suggests that Gci and Jci measured in this way should also provide a strength property that is applicable to failure prediction in much smaller microelectronic joints. In fact, some preliminary fracture predictions of solder balls in a PBGA package showed a good agreement with experimental observations. The scope of this study was limited to quasi-static loading, but the methodology can be extended to impact and hightemperature loading conditions.
Keywords: lead-free solder, fracture prediction, finite element analysis, PBGA
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