Effect Of Assembly Variations On Triple Stack Package On Package Yield And ReliabilityAuthors: Jimmy Chow, Heather McCormick, Russell Brush, Joel Trudell and Roden Cortero
Company: Celestica Inc.
Date Published: 5/17/2010 Conference: ICSR (Soldering and Reliability)
This paper is focused on the manufacturability and reliability issues of a 12mm square Triple Stack PoP component. The pitch of the bottom device, soldered to the board, is 0.5mm allowing for 305 I/O while the pitch of both the middle and upper package is 0.65mm, permitting 128 I/O on each device layer. This study compares assembly yields for both dip flux and dip paste PoP assembly processes, including the effect of variations in dip depth. The reliability of the different assembly variations in accelerated thermal cycling (ATC) is presented, including underfilled and non-underfilled variations. Failure analysis results are presented to help better understand the failure modes for this package.
Key words: Triple Stack Package on Package (PoP), 3-D Packaging, Dip Flux, Dip Paste, Reliability
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