ICSR (Soldering and Reliability) Conference Proceedings


Experimental Techniques For Characterizing The Thermal And Mechanical Properties Of Halogen-Free Laminates

Authors: David Lau, Y. Norman Zhou, Julie Liu, Madusha Cooray and Laura J. Turbini
Company: University of Waterloo and Research In Motion
Date Published: 5/17/2010   Conference: ICSR (Soldering and Reliability)


Abstract: The purpose of this study is to examine the experimental techniques for analyzing the thermal and mechanical properties of various halogen-free laminates used in handheld electronic products. The experimental techniques for thermal analysis are Differential Scanning Calorimetry (DSC), Thermo-mechanical Analyzer (TMA), Dynamic Mechanical Analyzer (DMA), and Thermo-gravimetric Analyzer (TGA), which measures Glass Transition Temperature (Tg), Coefficient of Thermal Expansion (CTE), Time to Delamination (T260 and T288), and Temperature to Decomposition (Td). Mechanical properties analysis techniques include DMA, three-point bend test, micro hardness test and copper peel test, which determine the flexural properties, Vickers hardness, and copper peel strength. Details for sample preparation and test conditions are provided. Also, scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDX) and mapping analyses for halogen-free laminates are discussed.

Key words: halogen-free; inorganic fillers; coefficient of thermal expansion; time to delamination; temperature to decomposition



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