ICSR (Soldering and Reliability) Conference Proceedings


Improving The R.O.S.E. Process Control and Quality Assurance Method

Authors: Mike Bixenman, Ph.D., Steve Stach and Curtis Hart
Company: Kyzen Corporation and Austin American Technology
Date Published: 5/17/2010   Conference: ICSR (Soldering and Reliability)


Abstract: Quality engineers have long known that cleanliness of printed wiring boards is crucial to the assembly’s performance and reliability. The common method for process control at the assembly level is IPC 2.3.25 – Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (R.O.S.E.). R.O.S.E. testing was highly beneficial since the test provided a quick and easy method for manufacturing technicians to statistically control and monitor the production assembly and cleaning processes. The R.O.S.E. method limitations arise from the methods inability to dissolve many of today’s flux residues and to remove and detect ionic contamination trapped under low clearance components. These limitations question the validity of the R.O.S.E. test method as a quality assurance and process control indicator on many of today’s leading edge circuit assemblies. To improve the R.O.S.E. method, three areas of research are in work: 1. Extract Solvents, 2. Ion Exchange Resins, and 3. Cleanliness Tester Equipment. The purpose of this research paper is to test the effectiveness of new Ion Exchange Resins for removing both ionic and non-ionic contaminants from engineered extract solvents.

Keywords: R.O.S.E., Ionic Cleanliness Testers, Cleaning, Reliability



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