HIGH SPEED TOUCH SCREEN ASSEMBLY USING ANISOTROPIC CONDUCTIVE ADHESIVES (ACAS) VERTICAL ULTRASONIC BONDING METHODAuthors: Kyung-Wook Paik, Seung-Ho Kim, and Kiwon Lee
Company: Korea Advanced Institute of Science and Technology (KAIST)
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
In terms of thermal deformation, U/S bonding showed no severe thermal deformation of TSPs up to 120 oC which is much higher than Tg of PET substrates. This result indicates that ACA can be heated up to 120 oC without severe thermal deformation of the PET substrates by VUS. It is presumably due to the rapid heating rate and the short bonding time of VUS bonding. As a summary, the VUS method can be successfully used in touch screen assembly with high speed and good reliability.
Key words: touch screen panels, ACA, vertical unltrsonic bonding, assembly
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.