Pan Pacific Symposium Conference Proceedings


Authors: Kyung-Wook Paik, Seung-Ho Kim, and Kiwon Lee
Company: Korea Advanced Institute of Science and Technology (KAIST)
Date Published: 1/26/2010   Conference: Pan Pacific Symposium

Abstract: A novel anisotropic conductive film (ACF) bonding process using ultrasonic vibration was investigated in touch screen panel(TSP)-on-board (TOB) applications. The ACF temperature increased as the U/S power increased and the bonding pressure decreased. The ACF temperature was successfully controlled by adjusting both U/S power and bonding pressure. The significant meaning of this result is that the ACF bonding process can be remarkably improved by U/S bonding compared with conventional T/C bonding. Using the optimized U/S bonding parameters, the ACF interconnects showed significantly less thermal damages to PET substrates and similar bonding performances as T/C bonding in terms of the contact resistance and the adhesion strength. And the cure degree of adhesive resin was achieved 90 % at 3 sec.

In terms of thermal deformation, U/S bonding showed no severe thermal deformation of TSPs up to 120 oC which is much higher than Tg of PET substrates. This result indicates that ACA can be heated up to 120 oC without severe thermal deformation of the PET substrates by VUS. It is presumably due to the rapid heating rate and the short bonding time of VUS bonding. As a summary, the VUS method can be successfully used in touch screen assembly with high speed and good reliability.

Key words: touch screen panels, ACA, vertical unltrsonic bonding, assembly

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