Pan Pacific Symposium Conference Proceedings


MOLDED INTERCONNECT DEVICES – PROGRESSIVE APPROACH FOR MECHATRONIC PRODUCTS AND EFFICIENT MANUFACTURING PROCESSES

Authors: Christian Goth, et al.
Company: University of Erlangen-Nuremberg
Date Published: 1/26/2010   Conference: Pan Pacific Symposium


Abstract: Growing demands for complexity and functionality arising from steady advances in technology are driving the development of new integration technologies in electronics. The increased use of electronics and the required miniaturization are forcing the pace of demand for complex mechatronic systems. In particular Molded Interconnect Devices (MID) are injected molded thermoplastic parts with integrated conductive pattern structure and allow highly integrated systems by combining electrical and mechanical functions (switches, shielding, fastening elements, etc.) that can not be achieved in this way by using conventional assembly and connection technologies.

The enormous design freedom for three-dimensional subassemblies affords scope for innovation and hence possibility of opening up new markets. Technological advances in the fields of structuring, metallization, assembly and especially in plastic materials have been accelerated and so, the more stringent demands from different sectors can increasingly be met.

Key words: Molded Interconnect Devices, MID, Mechatronic Systems



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