MOLDED INTERCONNECT DEVICES – PROGRESSIVE APPROACH FOR MECHATRONIC PRODUCTS AND EFFICIENT MANUFACTURING PROCESSESAuthors: Christian Goth, et al.
Company: University of Erlangen-Nuremberg
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
The enormous design freedom for three-dimensional subassemblies affords scope for innovation and hence possibility of opening up new markets. Technological advances in the fields of structuring, metallization, assembly and especially in plastic materials have been accelerated and so, the more stringent demands from different sectors can increasingly be met.
Key words: Molded Interconnect Devices, MID, Mechatronic Systems
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