CHIP-LAST INTERCONNECTION TO THIN ORGANIC PACKAGES WITH ADVANCED DILECTRICS AND FINE PITCH I/OSAuthors: Rao R. Tummala, Ph.D., Venkatesh Sundaram, Ph.D., Nitesh Kumbhat, and Nithya Sankaran
Company: Packaging Research Center, Georgia Institute of Technology
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
Keywords: Chip-First, Chip-Last, Dilectrics, EMAP, Embedded Actives, Fine Pitch, Interconnect
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