Pan Pacific Symposium Conference Proceedings


CHIP-LAST INTERCONNECTION TO THIN ORGANIC PACKAGES WITH ADVANCED DILECTRICS AND FINE PITCH I/OS

Authors: Rao R. Tummala, Ph.D., Venkatesh Sundaram, Ph.D., Nitesh Kumbhat, and Nithya Sankaran
Company: Packaging Research Center, Georgia Institute of Technology
Date Published: 1/26/2010   Conference: Pan Pacific Symposium


Abstract: Three miniaturization developments have been underway for more than a decade. These include thin core, fine line wiring and embedded chip technologies. This paper proposes and describes the latest advances and results in all these. It describes advanced low-loss dilectrics and wiring down to 10 microns, thin organic cores down to 50 microns thickness, and chip-last interconnection as a simpler and lower cost alternative to chip-first.

Keywords: Chip-First, Chip-Last, Dilectrics, EMAP, Embedded Actives, Fine Pitch, Interconnect



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