Pan Pacific Symposium Conference Proceedings


NEW PACKAGING AND INTERCONNECT TECHNOLOGIES FOR ULTRA THIN CHIPS

Authors: Christine Kallmayer, Rolf Aschenbrenner, Julian Haberland and Herbert Reichl
Company: Fraunhofer IZM and Technical University Berlin
Date Published: 1/26/2010   Conference: Pan Pacific Symposium


Abstract: This paper shows different approaches to use the availability of ultrathin chips for the realization of new packages with high density and improved performance.

For several years technologies have been developed for the embedding of chips in circuit boards in order to achieve 3-D-packages using conventional processes from PCB manufacturing.

Ultrathin chips are suited to be integrated in rigid circuit boards as well as on and in multilayer flexible substrates. The use of interposers prior to embedding can facilitate the embedding of components with ultra fine pitches.

An example for a complex RFID-based product will be shown which is enabled by the integration of ultrathin dies.



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