NEW PACKAGING AND INTERCONNECT TECHNOLOGIES FOR ULTRA THIN CHIPSAuthors: Christine Kallmayer, Rolf Aschenbrenner, Julian Haberland and Herbert Reichl
Company: Fraunhofer IZM and Technical University Berlin
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
For several years technologies have been developed for the embedding of chips in circuit boards in order to achieve 3-D-packages using conventional processes from PCB manufacturing.
Ultrathin chips are suited to be integrated in rigid circuit boards as well as on and in multilayer flexible substrates. The use of interposers prior to embedding can facilitate the embedding of components with ultra fine pitches.
An example for a complex RFID-based product will be shown which is enabled by the integration of ultrathin dies.
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