MODERN 2D / 3D X-RAY INSPECTION - EMPHASIS ON BGA, QFN, 3D PACKAGES, AND COUNTERFEIT COMPONENTSAuthors: Evstatin Krastev and David Bernard
Company: Nordson DAGE
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
Recent years have brought significant improvement in the capabilities in the 2D/3D X-Ray Inspection systems. New X-ray sources, detectors, and ergonomic features improve the efficiency and productivity of the inspection process.
This paper reviews the methods of finding defects in BGAs, QFNs, and 3D packages using X-Ray inspection with real-life examples provided. Voiding, cracks, shorts, open joints, and head in pillow (HIP) will be discussed. Comparison of the relative merits of the 2D and 3D (CT) X-Ray inspection for investigating 3D packages is presented with examples. Using X-Ray inspection for detecting counterfeits is discussed at the end.
Key words: BGA, QFN, X-ray inspection, Computer Tomography, CT, 3D packages, POP, PIP, SIP, stacked die, defect
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