Pan Pacific Symposium Conference Proceedings


MODERN 2D / 3D X-RAY INSPECTION - EMPHASIS ON BGA, QFN, 3D PACKAGES, AND COUNTERFEIT COMPONENTS

Authors: Evstatin Krastev and David Bernard
Company: Nordson DAGE
Date Published: 1/26/2010   Conference: Pan Pacific Symposium


Abstract: With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and dense packages have more opportunities to exhibit defects both internal to the package as well as to the PCB. As components increase in complexity their cost increases, making counterfeiting them a potentially lucrative business for unscrupulous individuals and organizations.

Recent years have brought significant improvement in the capabilities in the 2D/3D X-Ray Inspection systems. New X-ray sources, detectors, and ergonomic features improve the efficiency and productivity of the inspection process.

This paper reviews the methods of finding defects in BGAs, QFNs, and 3D packages using X-Ray inspection with real-life examples provided. Voiding, cracks, shorts, open joints, and head in pillow (HIP) will be discussed. Comparison of the relative merits of the 2D and 3D (CT) X-Ray inspection for investigating 3D packages is presented with examples. Using X-Ray inspection for detecting counterfeits is discussed at the end.

Key words: BGA, QFN, X-ray inspection, Computer Tomography, CT, 3D packages, POP, PIP, SIP, stacked die, defect



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