QUALITY AND RELIABILITY ANALYSIS OF LEAD FREE PCBs IN SIMULATED PRODUCTION CONDITIONS AND LONG TERM USEAuthors: Sammy Shina, Ph.D., et al.
Company: University of Massachusetts
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
In this fourth phase of testing, which began in 2007, several simulated conditions of assembly and rework processes were evaluated in a matrix of multiple levels of components, PWB lead free surface finishes and solders, and compared to a baseline of leaded equivalent materials and processes. Both Through Hole (THT) and Surface Mount (SMT) Technologies were evaluated.
All quality and reliability testing was performed with industry standard methodologies, using specially trained production inspectors for the quality evaluation, and extreme thermal cycling and vibrations for reliability testing.
Our results indicate that with proper selection of currently available (2009) materials and finishes and careful control of the assembly processes, successful lead free assembly and rework can be achieved. Comparison of different strategies for rework, and recommendations for least copper dissolution for THT technology processes are discussed in chapter 6 of a book  published by the authors. Reliability testing showed inflection points for leaded versus lead free reliability that is currently being investigated through means detailed later in this paper.
Key words: Lead Free, Visual Inspection, Rework, Reliability testing, Thermal Cycling, Design of Experiments
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