Pan Pacific Symposium Conference Proceedings


Author: Hartmut Berndt
Company: B.E.STAT European ESD competence centre
Date Published: 1/26/2010   Conference: Pan Pacific Symposium

Abstract: The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give an overview about possible causes for ESD in a SMT production line.

Particularly automated production lines have some processing steps, where electrostatic charges are increasingly generated. So far one has been focused on the human being. This is controllable. Measurements in production lines show electrostatic charges at the following processing steps: application of soldering paste (printer), assembling (automated and manual pick and place), and labelling as well as optical and electrical tests (ICT). The electronic components are always assembled directly and without any covering on the PCBs. Thus, the wire bonding process leads to a damage of the electronic components. This process step is a very critical part in the production line. The electronic devices will be directly contacted with a metal needle.

The process steps, where the PCBs are covered with enclosures must be inspected either. Such enclosures are mostly made of isolating materials, like plastics. Thus, those can be electrostatic charged highly, while assembling.

An optimized ESD Control System for machines with the emphasis on cost-effectiveness will be presented.

Key words: Automation SMT production line, Automation handling equipment, Electrostatic discharge, ESD Control System, Product quality

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