SILICON INTERPOSER FOR HETEROGENEOUS INTEGRATIONAuthors: M. Juergen Wolf, et al.
Company: Fraunhofer Institute for Reliability and Microintegration IZM
Date Published: 1/26/2010 Conference: Pan Pacific Symposium
One of the most promising technology approaches is 3D packaging which involves a set of different integration ap-proaches. Silicon interposer with TSV´s offers a new possi-bility to merge advanced devices e.g. high pin count ASICs, memories and MEMS using a silicon interposer with Through Silicon Vias (TSVs). Two applications using a Si Interposer are described in this paper.
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