Author: Henry H. Utsunomiya Company: Interconnection Technologies, Inc. Date Published: 1/26/2010
Pan Pacific Symposium
Abstract: This presentation will outline the market dynamics driving the development of advanced substrates in today’s industry landscape. Technological advancements have shifted from Personal Computers to Mobile Applications like Cellular phones, MPEG players, etc. An overview of the technology revolution of substrates and their corresponding packages will be discussed in terms of technology supply chain matching: assembly technology, substrate technology and system technology. Advanced substrate technology roadmaps of leading Japanese suppliers will be reviewed. The evolution of buildup substrates, which have standardized under the direction of CPU & FPGA manufacturers will be explained. The two technological directions of substrates for advanced electronic packages will be mapped out: miniaturization and functional integration, and explained in terms of “More Moore” and “More than Moore”, respectively. Fine pitch wiring on substrates can be combined with embedded active and passive devices and has been proven as a technology. Examples/ illustrations of advanced substrate applications in servers, hand -helds, and high end servers and communication equipments will be reviewed: PoP, Embedded Active Devices, Si interposers and Wafer Level Packages, etc.
Key words: Packaging substrate, Embedded Active Devices, Si Interposer, Wafer Level Package, PoP