Surface Mount International Conference Proceedings


EFFECTS OF COMPONENT SOLDERABILITY ON SOLDER FILLET SHAPE AND PROCESS YIELD

Author: Martin Wickham
Company: Surface Mount Club
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Interim results on the manufacture of test assemblies for thermal cycling are presented. A relationship between decreasing component solderability and reduced reflow soldering yields for surface mount chip resistors based on a visual inspection ranking is shown. A level of component solderability of below 80°/0of the as-received value was found to cause visually unacceptable solder joints.



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