SMTA International Conference Proceedings


INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY

Authors: Frank Ferdinandi
Company: Semblant Technologies
Date Published: 10/4/2009   Conference: SMTA International


Abstract: A new PCB surface finish has been developed that offers outstanding performance and excellent environmental protection. This finish has the potential to replace more common finishes such as ENIG, ImAg, ImSn, ENEPIG, or OSP with a chemically resistant plasma deposited coating. The substitution of the wet processes with this dry plasma process offers significant advantages e.g. lower quantities of chemicals used, environmental benefits and improved operator safety.

The surface finish is applied to the whole board offering unique chemical protection before and after the soldering operation. A substantial test program has been undertaken investigating a wide range of performance characteristics of the PCBs including solder performance, corrosion resistance, electrical performance, RF performance and many other PCB performance characteristics.

Key words: surface finish, PCB, plasma deposited



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