CHARACTERIZING THE RELATIONSHIPS BETWEEN A SOLDER PASTE'S INGREDIENTS AND ITS PERFORMANCE ON THE ASSEMBLY LINE: HEAD-IN-PILLOW TESTINGAuthors: Frank Murch, Derrick Moyer, Krupali Patel, John McMaster, Steve Ratner, and Martin Lopez
Company: Heraeus Materials Technology, LLC
Date Published: 10/4/2009 Conference: SMTA International
This paper provides a brief overview of the new solder paste development and benchmarking processes, and introduces a new method for assessing a solder paste’s robustness against Head-In-Pillow defects1.
Key words: Solder Paste, Benchmarking, BGA Head-In-Pillow, Design For Six Sigma
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