SMTA International Conference Proceedings


CHARACTERIZING THE RELATIONSHIPS BETWEEN A SOLDER PASTE'S INGREDIENTS AND ITS PERFORMANCE ON THE ASSEMBLY LINE: HEAD-IN-PILLOW TESTING

Authors: Frank Murch, Derrick Moyer, Krupali Patel, John McMaster, Steve Ratner, and Martin Lopez
Company: Heraeus Materials Technology, LLC
Date Published: 10/4/2009   Conference: SMTA International


Abstract: With the majority of the circuit assembly industry focused on Lead-free soldering, Tin-Lead has been overlooked for a long time. So when paste formulators set out to create a brand new Tin-Lead platform, they wanted to use the most modern materials and methods available. Synthetic or highly purified raw materials have displaced many of their naturally occurring predecessors as primary ingredients due to their superior stability, and the old trial and error experimental strategies that were used to develop past generations of solder pastes have been replaced with sophisticated Design For Six Sigma tools. The result is a better understanding of the relationships between a paste's composition and its behavior in print and reflow processes.

This paper provides a brief overview of the new solder paste development and benchmarking processes, and introduces a new method for assessing a solder paste’s robustness against Head-In-Pillow defects1.

Key words: Solder Paste, Benchmarking, BGA Head-In-Pillow, Design For Six Sigma



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