NOZZLE TECHNOLOGY FOR LEAD FREE SELECTIVE SOLDERINGAuthors: Ursula Marquez de Tino, Linlin Yang and Denis Barbini
Company: Vitronics Soltec, Inc.
Date Published: 10/4/2009 Conference: SMTA International
The results of visual inspection and quantitative analysis of the electrical shorts formed during the designed experiment showed that wettable nozzles produced less bridging defects than non-wettable nozzles. Furthermore, bridging defects were minimized with the use of nozzle diameters equal to or greater than 6 mm along with the faster drag speed (2 mm/s). Soldering temperature did not exert an impact on bridging.
Results from X-ray analysis of through-hole penetration showed that vias soldered with the wettable nozzle were statistically filled and met the IPC 610D class 3 qualification for hole fill at a slightly higher rate than those vias soldered with non-wettable nozzles. Better through hole penetration was observed when soldering temperature of more than 3000C and nozzle diameters of 8 mm for the wettable and 4 mm for the non-wettable were used.
Key words: wettable nozzles, non-wettable nozzles, selective soldering, 5DX, through hole
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